Food Grade Heat Sink Compound

In stock

Heat Sink compound is applied to the electronic devices for heat transfer which is located in and around food processing area.


A non-reative, silicone, thermally conductive food grade thermal grease with high thermal conductivity and low thermal resistance in a soft non-flowable consistency.  This product is formulated with FDA approved ingredients and is acceptable as incidental food contact for use in and around food processing area.

• NSF H1 approved.

• 8 oz. Jar

• Operating temperature range: -55° C to 205° C.

More Information
Weight 1.0000
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