Food Grade Heat Sink Compound
Heat Sink compound is applied to the electronic devices for heat transfer which is located in and around food processing area.
A non-reative, silicone, thermally conductive food grade thermal grease with high thermal conductivity and low thermal resistance in a soft non-flowable consistency. This product is formulated with FDA approved ingredients and is acceptable as incidental food contact for use in and around food processing area.
• NSF H1 approved.
• 8 oz. Jar
• Operating temperature range: -55° C to 205° C.